| Sr. Engineer, Photonics Packaging Location: Hsinchu
Ayar Labs is seeking a hands-on Photonics Packaging Engineer to join our Packaging Team in Taiwan and drive the development and production readiness of photonic packaging solutions for silicon photonics and semiconductor laser platforms. This role focuses on fiber attach enablement, optical assembly process development, equipment ownership, and manufacturing scale-up.
You will work closely with cross-functional partners across Engineering, Manufacturing, Supplier Quality, and Supply Chain, as well as external manufacturing partners, to support supplier readiness and high-volume production while meeting performance, yield, and reliability targets. Responsibilities - Develop, qualify, and optimize fiber attach and optical assembly processes for photonic packaging platforms.
- Enable packaging solutions for grating couplers, edge couplers, and fiber-array integration, including alignment strategies and process characterization.
- Select, evaluate, and qualify optical adhesives/epoxies for photonic packaging, including material screening, process windows, and reliability considerations.
- Own key optical assembly equipment and infrastructure, including setup, calibration, troubleshooting, preventative maintenance, and continuous improvement.
- Build and maintain process monitoring and control methods, including SPC and production databases, to support yield improvement and process stability.
- Drive automation initiatives for optical alignment and fiber attach processes.
- Evaluate and support integration of detachable optical connectors and connectorized optical I/O solutions.
- Provide technical support for external manufacturing partners (OSATs/CMs) during development and production ramps.
- Collaborate across optical, mechanical, electrical, and reliability teams to ensure packaging solutions meet system-level requirements.
Required Qualifications - BS, MS, or PhD in Optics, Physics, Mechanical Engineering, Materials Science and Engineering, or a related field; or equivalent industry experience.
- 3+ years of experience in photonics packaging, fiber attach, and/or optical assembly process development.
- Experience with precision fiber alignment for grating couplers and/or edge couplers, including fiber arrays.
- Hands-on experience owning optical assembly tools and supporting tool calibration, maintenance, and troubleshooting.
- Experience with optical adhesives/epoxies, including selection, dispensing/curing considerations, and impact on alignment and reliability.
- Experience with process monitoring and yield improvement methods, including SPC and data-driven analysis.
- Experience working with OSATs/CMs or external manufacturing partners.
- Working knowledge of silicon photonics and semiconductor laser packaging fundamentals.
- Familiarity with semiconductor processing and packaging manufacturing workflows.
Preferred Qualifications - Experience with automated optical alignment and fiber attach systems.
- Experience with 6-axis alignment systems, vision systems, and fiducial recognition.
- Opto-mechanical design experience for active or passive optical alignment.
- Experience evaluating optical connectors or connectorized optical I/O solutions.
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